Dicing Tape 

Precision Holding, Seamless Release 

KEY FEATURES

• Superior Adhesion
  High-speed cutting stability prevents chip shifting or flying under coolant pressure. 
• UV-Release Technology 
  During Dicing Strong hold, Post-Process Instant adhesion loss via UV light for stress-free pick-up. 
• Damage & Contamination Control
  Minimizes chip chipping and ensures zero adhesive residue on the wafer backside.