MLCC

The perfect partner for ultra-precision MLCC manufacturing. From strong fixation to clean separation, we maximize process efficiency.

KEY FEATURES

• High Initial Adhesion
  Ensures stable fixation during high-speed dicing without any displacement. 
• Flying-Chip Prevention
  Completely blocks the loss or detachment of micro-chips during the sawing process. 
• Process Resistance
  Maintains strong adhesion under high-pressure cooling water and vacuum environments. 
• UV Adhesion Control
  Provides instant reduction in adhesion after UV irradiation for easy, stress-free pick-up. 
• Residue-Free (Zero Contamination)
  Ensures perfectly clean peeling with no adhesive residue left on the chip surface.

BENEFITS

• Yield Maximization
  Minimizes chip damage and loss to enhance overall production efficiency. 
• Precision Pick-up Support
  Protects fragile chips from physical stress through optimized low peel strength. 
• Ultra-Small Component Optimization
  Fully compatible with micro-scale MLCC processes, including 0402 and 0201 sizes.