태양광 판넬 · BUS BAR
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태양광 판넬
Bus Bar
고정용 Black tape
HDI, IC PCB Protective
| TEST ITEM | DATE | TEST METHOD | |
|---|---|---|---|
| PI film Thickness (㎛) | 50±2.5 | Mistutoyo mester | |
| Adhesive Thickness (㎛) | 10±3 | ||
| Release liner Thickness (㎛) | 35 | ||
| Maximum twmp for continuous use | 220℃ / 90min | - | |
| Storage condition | room temp, 60% humidity, 6 months | - | |
| Adhesion (gf / in) | To Stainless plate | single-sided thermal reaction | PSTC-1 (room temp) |
- High heat resistant molding protective & releasing function
- Easy releasing, processing, Non silicon Out-Gassing caused side effect
- Assenbly, HDI, IC Molding application